Integrated circuit packaging system with multi-tier...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257SE23142

Reexamination Certificate

active

07928552

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; providing a substrate; mounting an integrated circuit over the substrate; mounting the carrier to the substrate with the first interconnect and the second interconnect attached to the substrate and with the planar surface over the integrated circuit; forming an encapsulation between the substrate and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad.

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