Integrated circuit packaging system with isolated pads and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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Details

C438S112000, C257SE21502, C257SE21510, C361S813000, C216S014000

Reexamination Certificate

active

07998790

ABSTRACT:
A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.

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patent: 2010/0001384 (2010-01-01), Bathan et al.

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