Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-08-16
2011-08-16
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S112000, C257SE21502, C257SE21510, C361S813000, C216S014000
Reexamination Certificate
active
07998790
ABSTRACT:
A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
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Bathan Henry Descalzo
Camacho Zigmund Ramirez
Caparas Jose Alvin
Tay Lionel Chien Hui
Everhart Caridad M
Ishimaru Mikio
Stats Chippac Ltd.
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