Integrated circuit packaging system with inward and outward...

Details Integrated circuit packaging system with inward and outward... Integrated circuit packaging system with inward and outward...

2011-04-19

2011-04-19

Kebede, Brook (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S686000, C257SE23031, C257SE21502, C257SE21503

Reexamination Certificate

active

07927917

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.

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