Integrated circuit packaging system with etched ring and die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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Details

C438S127000, C029S874000, C257S669000, C257S670000, C257S676000, C257S692000, C257SE23031, C257SE23043, C257SE23045, C361S813000

Reexamination Certificate

active

07863108

ABSTRACT:
A method of manufacture of an integrated circuit packaging system is provided including: forming a D-ring includes half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.

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