Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-02-15
2011-02-15
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S123000, C257S666000, C257S702000
Reexamination Certificate
active
07888184
ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
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Chow Seng Guan
Ha Jong-Woo
Kuan Heap Hoe
Shim Il Kwon
Yoon Seung Uk
Landau Matthew C
Mitchell James M
Stats Chippac Ltd.
Tshimaru Mikio
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