Integrated circuit packaging system with carrier and method...

Details Integrated circuit packaging system with carrier and method... Integrated circuit packaging system with carrier and method...

2011-02-08

2011-02-08

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07884460

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

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Office Action for Japanese Patent Application No. 54269/2007.

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