Integrated circuit packaging system with base structure device

Details Integrated circuit packaging system with base structure device Integrated circuit packaging system with base structure device

2011-03-29

2011-03-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S778000, C257S787000, C257S784000, C257SE23169, C438S109000, C438S127000, C438S617000

Reexamination Certificate

active

07915724

ABSTRACT:
An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.

REFERENCES:
patent: 5608262 (1997-03-01), Degani et al.
patent: 5646826 (1997-07-01), Katchmar
patent: 5808878 (1998-09-01), Saito et al.
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 6812567 (2004-11-01), Kim et al.
patent: 6856027 (2005-02-01), Wang
patent: 6921968 (2005-07-01), Chung
patent: 7061121 (2006-06-01), Haba
patent: 2002/0089050 (2002-07-01), Michii et al.
patent: 2004/0212067 (2004-10-01), Wang
patent: 2007/0013038 (2007-01-01), Yang
patent: 2007/0145548 (2007-06-01), Park et al.
patent: 2007/0181989 (2007-08-01), Corisis et al.

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