Integrated circuit packaging system with a protrusion on an...

Details Integrated circuit packaging system with a protrusion on an... Integrated circuit packaging system with a protrusion on an...

2011-01-04

2011-01-04

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C257S730000, C257S786000, C257S790000, C257SE23126, C257SE23128, C257SE21503

Reexamination Certificate

active

07863109

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing an inner stacking module die; encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface; and encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.

REFERENCES:
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patent: 7306974 (2007-12-01), Brand
patent: 2007/0059865 (2007-03-01), Huang et al.
patent: 2007/0284139 (2007-12-01), Chin et al.
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patent: 2008/0145589 (2008-06-01), Hung et al.
patent: 2009/0152740 (2009-06-01), Park et al.
patent: 2009/0243064 (2009-10-01), Camacho et al.

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