Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-04-12
2011-04-12
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S108000, C438S124000, C438S015000, C438S051000, C257SE21499, C257SE21502, C257SE21503, C257SE21505, C257SE21508
Reexamination Certificate
active
07923290
ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.
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Kim Young-Chul
Ko Chan Hoon
Park Soo-San
Ahmadi Mohsen
Ishimaru Mikio
Mulpuri Savitri
Stats Chippac Ltd.
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