Integrated circuit packaging system having an internal...

Details Integrated circuit packaging system having an internal... Integrated circuit packaging system having an internal...

2011-08-09

2011-08-09

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S782000, C438S109000

Reexamination Certificate

active

07994625

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

REFERENCES:
patent: 7250677 (2007-07-01), Lin
patent: 7253511 (2007-08-01), Karnezos et al.
patent: 2003/0134451 (2003-07-01), Chen
patent: 2007/0158810 (2007-07-01), Song et al.
patent: 2009/0072375 (2009-03-01), Song et al.

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