Integrated circuit packaging system having a cavity

Details Integrated circuit packaging system having a cavity Integrated circuit packaging system having a cavity

2011-08-02

2011-08-02

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C438S015000, C438S025000, C438S026000, C438S027000, C438S028000, C257SE21499, C257SE23001, C257SE33059, C257SE23020

Reexamination Certificate

active

07989950

ABSTRACT:
An integrated circuit packaging system includes: attaching a carrier, having a carrier top side and a carrier bottom side, and an interconnect without an active device attached to the carrier bottom side; and forming a first encapsulation, having a cavity, around the interconnect over the carrier top side with the interconnect partially exposed from the first encapsulation and with the carrier top side partially exposed with the cavity.

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