Integrated circuit packaging process

Details Integrated circuit packaging process Integrated circuit packaging process

1982-05-03

1984-08-21

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

357 69, 428582, 174 52PE, 29827, H01R 4300, H01L 2350

Patent

active

044661835

ABSTRACT:
In an automatic tape assembly process an IC chip is bonded to the finger pattern created in a metal assembly tape. Then the housing is applied to encapsulate the IC during assembly. An insulating strip is then applied to the metal fingers that will ultimately become the packaged device loads. The strip is located just inside that point where the fingers will be excised from the tape so that after excision the strip will hold the leads in position for testing and handling.

REFERENCES:
patent: 3803709 (1974-04-01), Beltz et al.
patent: 3882597 (1975-05-01), Chayka et al.
patent: 4063993 (1975-12-01), Burns
patent: 4089733 (1978-05-01), Zimmerman
patent: 4204317 (1980-05-01), Winn
patent: 4330790 (1982-05-01), Burns
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4355463 (1982-10-01), Burns
patent: 4380042 (1983-04-01), Angelucci et al.

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