Fishing – trapping – and vermin destroying
Patent
1986-02-13
1987-09-01
Hearn, Brian E.
Fishing, trapping, and vermin destroying
357 80, 357 70, 29835, 437209, H01L 2304
Patent
active
046898751
ABSTRACT:
The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar base is adehered to the surface of the chip having the electrical pads. The leads are then bent over the base to secure the base on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure. At a desired time, the complete chip packaging structure may be removed from the tape by cutting the frame.
REFERENCES:
patent: 3395447 (1968-06-01), Beyerlein
patent: 3698074 (1972-10-01), Helda et al.
patent: 3735214 (1973-05-01), Renskers et al.
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4280132 (1981-07-01), Hayakawa et al.
Hearn Brian E.
Pawlikowski Beverly A.
VTC Incorporated
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