Integrated circuit packaging for improving effective...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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Details

C438S127000

Reexamination Certificate

active

06960491

ABSTRACT:
A packaging process for improving effective chip-bonding area is disclosed in the present invention. An A-stage liquid paste is formed on a substrate and partially cured to become a B-stage film layer. The B-stage film layer is maintained without fully cured passing through a chip-attaching step and an electrically connecting step. During the molding step, the packing pressure for the molding compound (1000 psi˜1500 psi) is larger than the chip attaching pressure for enabling the B-stage film layer to be closely compressed in order to improve effective chip-bonding area. The B-stage film layer and the molding compound are cured simultaneous in the molding step.

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