Integrated circuit packaging architecture

Details Integrated circuit packaging architecture Integrated circuit packaging architecture

2005-12-27

2005-12-27

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S712000

Reexamination Certificate

active

06979891

ABSTRACT:
A system may include an integrated circuit package having a package power contact and a package ground contact, and an interposer to physically receive a portion of the package and including a lip. A system may also include a first card having a card power contact to interface with the package power contact and a card ground contact to interface with the package ground contact, where the first card defines an opening to receive a portion of the interposer, and the lip is to support a portion of the first card.

REFERENCES:
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patent: 5621245 (1997-04-01), Agatstein et al.
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patent: 6359783 (2002-03-01), Noble
patent: 6586684 (2003-07-01), Frutschy et al.
Brown, Dirk et al., “An Adaptable, High Performance LGA Connector Technology”, HCD, Inc. 6pgs.
“Modular Subsystems and High Frequency Solutions”, HCD Connectors, Aug. 2002, 12pgs.

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