Integrated circuit packaging and cooling

Details Integrated circuit packaging and cooling Integrated circuit packaging and cooling

1988-09-07

1990-03-27

Thompson, Gregory

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 16510433, 174 151, 357 82, 361382, H05K 720

Patent

active

049126008

ABSTRACT:
A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.

REFERENCES:
patent: 2906103 (1959-09-01), Saltzman
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4407136 (1983-10-01), de Kanter
patent: 4729424 (1988-03-01), Mizuno et al.
patent: 4750086 (1988-06-01), Mittal
patent: 4772980 (1988-09-01), Curtis et al.
Crawford, "High-Power Electronic Device", IBM Technical Disclosure Bulletin, vol. 20, No. 11A, 4/78, pp. 4393-4398, 361/385.

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