Integrated circuit packaging

Details Integrated circuit packaging Integrated circuit packaging

1985-03-20

1987-07-14

Howell, Janice A.

Radiant energy

Invisible radiant energy responsive electric signalling

Semiconductor system

356 29, 250388, G01T 122

Patent

active

046804714

ABSTRACT:
An integrated circuit comprising: a semiconductor die having an integrated circuit formed therein; a package for supporting the die and for providing electrical contact thereto, the radiation properties of the package having been characterized as follows: fabricating a detector using a semiconductor fabrication technique, the detector having substantially the same dimensions as an integrated circuit to be packaged in the packaging materia; packaging the detector using integrated circuit packaging techniques; and measuring the radiation environment of the detector.

REFERENCES:
patent: 3609478 (1971-09-01), King et al.
patent: 4423548 (1984-01-01), Hulseweh

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