Integrated circuit packaging

Details Integrated circuit packaging Integrated circuit packaging

1975-07-16

1977-06-07

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29588, 29591, B01J 1700

Patent

active

040273830

ABSTRACT:
Lead connections and packaging for integrated circuits are formed by processing elongated ribbon arrays of integrated circuit dice in groups prior to cutting the ribbon along its length to free the discrete integrated circuit products. The ribbon is adhered to the base of an elongated channel having at least one leg containing implanted lead-in conductors arranged therein as an axial series of axial arrays of conductors. The axial arrays are aligned with the circuits on the ribbons and interconnections therebetween are formed as photolithographically defined conductive coatings on a top surface of the ribbon extending from bonding pads of the integrated circuit to exposed conductor ends at a top end(s) of the leg(s). The channel ribbon assembly is cut into discrete circuits after forming such interconnections for all the circuits of the ribbon as a group. Each array of lead-in conductors is packed in high density and fans out from the channel to an array of low density lead-out conductors which may be plugged into sockets or otherwise macroscopically treated.

REFERENCES:
patent: 3262022 (1966-07-01), Carracciolo
patent: 3771219 (1973-11-01), Tuzi

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