Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2008-03-04
2008-03-04
Loke, Steven (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S678000, C257S686000, C257S691000, C257S707000, C257S724000, C257S772000, C257SE21499
Reexamination Certificate
active
10880150
ABSTRACT:
An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region.
REFERENCES:
patent: 5798567 (1998-08-01), Kelly et al.
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6424034 (2002-07-01), Ahn et al.
patent: 6489686 (2002-12-01), Farooq et al.
patent: 6555920 (2003-04-01), Chung et al.
patent: 6657133 (2003-12-01), Chee
patent: 6703697 (2004-03-01), Leahy et al.
patent: 6713860 (2004-03-01), Li
patent: 6713871 (2004-03-01), Searls et al.
patent: 6777818 (2004-08-01), Baldwin
patent: 7019346 (2006-03-01), Mosley
patent: 7053491 (2006-05-01), Martin et al.
patent: 7268419 (2007-09-01), Cornelius
patent: 2002/0135053 (2002-09-01), Figueroa et al.
patent: 2003/0102555 (2003-06-01), Patel et al.
patent: 2003/0122638 (2003-07-01), Tarui et al.
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0124511 (2004-07-01), Li
patent: 2004/0245014 (2004-12-01), Zhong et al.
patent: 2004/0245610 (2004-12-01), Zhong et al.
patent: 2006/0288567 (2006-12-01), Lloyd et al.
Radhakrishnan Kaladhar
Stone Brent S.
Wood Dustin P.
Intel Corporation
Loke Steven
Nguyen Tram H
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Integrated circuit packages, systems, and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit packages, systems, and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit packages, systems, and methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3913632