Integrated circuit packages having an externally mounted lead fr

Details Integrated circuit packages having an externally mounted lead fr Integrated circuit packages having an externally mounted lead fr

1996-05-13

1999-11-02

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257692, 257696, 257686, 257713, 361813, 361718, 361712, H05K 720, H01L 2340

Patent

active

059782277

ABSTRACT:
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

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