Integrated circuit packages and the method for making the same

Details Integrated circuit packages and the method for making the same Integrated circuit packages and the method for making the same

2005-01-25

2005-01-25

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S455000

Reexamination Certificate

active

06846697

ABSTRACT:
This invention relates to a method and a means for packaging integrated circuits, especially relates to a heat sink in the operating integrated circuit packages. The heat sink is bonded on the lead frame by a tap and takes advantage of the length between the heat sink and the first mold packaged materials at the first axis to be about equal to the length between the chip and the second mold packaged materials at the first axis to prevent producing voids that would form unbalanceable thermal mold flow. The heat sink can also dissipate heat from the lead frame to others spaces in the integrated circuit packages. This method and means can prevent delaminating and cracking occurring in the chip and can increase the quality of integrated circuits.

REFERENCES:
patent: 5172213 (1992-12-01), Zimmerman
patent: 5629561 (1997-05-01), Shin et al.
patent: 5825623 (1998-10-01), Lee et al.

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