Integrated circuit packages

Details Integrated circuit packages Integrated circuit packages

1985-04-08

1987-06-09

James, Andrew J.

357 74, 357 72, H01L 2330, H01L 2348, H01L 2304

Patent

active

046724184

ABSTRACT:
An integrated circuit package including a lead frame (11) sealed between base and cap portions (1 and 3) of the package enclosure. Outwards of the seal each lead (13) in the frame (11) follows an angled path so that manipulation of leads outside the package is unlikely to damage the seal. The angling of the leads (13) is effected by appropriately shaping the cap and base parts (1 and 3) of the package.

REFERENCES:
patent: 3673309 (1972-06-01), Dalmasso
patent: 3909838 (1975-09-01), Beyerlein
patent: 4218701 (1980-08-01), Shirasaki
patent: 4463217 (1984-07-01), Orcutt
patent: 4530002 (1985-07-01), Kanai
patent: 4554404 (1985-11-01), Gilder, Jr. et al.

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