Integrated circuit packaged power supply

Electric power conversion systems – Current conversion – With cooling means

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H05K 720

Patent

active

056216351

ABSTRACT:
A design for and method of assembling a power supply or power converter. The design is based on mounting the heat generating elements of the device, such as an integrated circuit or other switching device in a manner which provides a direct thermal coupling between those devices and the inductors or transformers which are part of the power supply or converter Using packaging techniques similar to those used in the semiconductor industry, the inductor or transformer is attached to one side of a lead frame. The heat generating elements are then mounted on top of the inductor or transformer. Passive components, such as capacitors, may be mounted on the lead frame. Additional heat generating components may also be mounted on the inductor or transformer. The resulting combination is then encapsulated in plastic or a molding compound typically used in the industry.

REFERENCES:
patent: 4488202 (1984-12-01), Kaufman
patent: 4635179 (1987-01-01), Carsten
patent: 4712160 (1987-12-01), Sato et al.
patent: 4722060 (1988-06-01), Quinn et al.
Brochure, "About Our Company," by Power Trends, Inc., undated, one page in length.
Brochure, "DC/DC Converter Thermal Characteristics," by Conversion Devices, Inc., undated, two pages in length.
Book, Microelectronics Packaging Handbook, Edited by R.R. Tummala & E.J. Rymaszewski, 1989, Publishers: Van Nostrand Reinhold, Chapter 9.2.3, "Power Supply and Heat Removal", pp. cover, copyright, and 684-685.
Book, Modern DC-To-DC Switchmode Power Converter Circuits, by R.P. Severns & G. (Ed) Bloom, Chapter 1, "Introduction to Switchmode Power Converters," 1988, Publishers: Van Nostrand Reinhold (New York), pp. cover and 1-10.

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