Integrated circuit package with thermal path layers incorporatin

Details Integrated circuit package with thermal path layers incorporatin Integrated circuit package with thermal path layers incorporatin

1987-05-12

1988-03-15

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361401, 361414, 165185, H05K 720

Patent

active

047317019

ABSTRACT:
An integrated circuit package includes a case incorporating an integrated circuit die. The case has several ceramic layers, including layers with apertures for defining a die cavity and two layers without apertures which serve as thermal path layers. The thermal path layers include mutually staggered vias which conduct heat from the die cavity to a heat spreader separated from the die by the thermal path layers. The vias of the two layers are not electrically coupled so that the heat spreader is thermally coupled and electrically uncoupled with respect to the die. The thermal path layers, the thermal vias and other thermal path elements are fabricated from the same set of materials used in the cavity-defining layers, electrical vias and conductive strips.

REFERENCES:
patent: 3728584 (1973-04-01), Kuhlow
patent: 4616655 (1986-10-01), Weinberg
patent: 4628407 (1986-12-01), August
patent: 4630172 (1986-12-01), Stenerson

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