Integrated circuit package with strain relief grooves

Details Integrated circuit package with strain relief grooves Integrated circuit package with strain relief grooves

1991-12-23

1993-03-16

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

257629, H05K 700, H01L 2328

Patent

active

051950235

ABSTRACT:
As the size and consequent thickness of IC packages shrink bowing of the package due to differential contractions becomes a problem. The solution according to this invention is to mold strain relief grooves into the surface of the plastic package.

REFERENCES:
patent: 4887149 (1989-12-01), Romano

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