Integrated circuit package with stabilizer bar

Details Integrated circuit package with stabilizer bar Integrated circuit package with stabilizer bar

1993-11-24

1995-01-10

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29827, H01L 2302

Patent

active

053809521

ABSTRACT:
A stabilizer bar made of non-conductive material (such as a poly enid plastic) is secured to the top side of extended leads on each side of a flat high density integrated circuit package. The bar is located intermediate the length of the leads, and is used as a lead form during a subsequent forming operation. The leads are formed around the stabilizer bar, which remains in place throughout the forming operation and during subsequent mounting of the integrated circuit package.

REFERENCES:
patent: 4482781 (1984-01-01), Burns
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4747017 (1988-05-01), Koors et al.
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4796080 (1989-01-01), Phy
patent: 4801561 (1989-01-01), Sankhagowit
patent: 5034568 (1991-07-01), Mather
patent: 5065504 (1991-11-01), Olla
patent: 5138115 (1992-08-01), Lam
patent: 5160810 (1992-11-01), Rohde et al.

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