Integrated circuit package with molded cell

Details Integrated circuit package with molded cell Integrated circuit package with molded cell

1991-12-03

1993-03-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437220, 429123, 439 68, 439 70, 365228, 365229, H01L 2160

Patent

active

051963744

ABSTRACT:
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

REFERENCES:
patent: 4380357 (1983-04-01), Evans et al.
patent: 4645943 (1987-02-01), Smith, Jr. et al.
patent: 4864373 (1989-09-01), Myashita
patent: 4998888 (1991-03-01), Link et al.
patent: 5008776 (1991-04-01), Queyssac
patent: 5055704 (1991-10-01), Link et al.
"Designer's Dream Machine", Electronics, vol. 60, No. 5, pp. 53-57, Mar. 1987.

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