Integrated circuit package with low-thermal expansion lead piece

Details Integrated circuit package with low-thermal expansion lead piece Integrated circuit package with low-thermal expansion lead piece

1986-07-30

1988-03-01

Pellinen, A. D.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 80, 428901, H01L 2314

Patent

active

047290102

ABSTRACT:
An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55.degree. C.

REFERENCES:
patent: 3340347 (1967-09-01), Spiegler
patent: 4135038 (1979-01-01), Takami et al.
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4370421 (1983-01-01), Matsushita et al.
patent: 4515898 (1985-05-01), Davis et al.
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4522925 (1985-06-01), Pirooz et al.
patent: 4554573 (1985-11-01), Yamamoto et al.
patent: 4571610 (1986-02-01), Matsushita et al.
patent: 4581279 (1986-04-01), Sugishita et al.
patent: 4591537 (1986-05-01), Aldinger et al.
patent: 4624896 (1986-11-01), Watanabe et al.
patent: 4651192 (1987-03-01), Matsushita et al.

Affiliated with

Also associated with

Rating

Integrated circuit package with low-thermal expansion lead piece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package with low-thermal expansion lead piece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package with low-thermal expansion lead piece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1002135