Integrated circuit package with improved return loss

Details Integrated circuit package with improved return loss Integrated circuit package with improved return loss

2007-11-13

2007-11-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE23062, C257SE23079, C257SE23069, C257S531000, C257S532000, C257S728000, C361S767000, C361S768000

Reexamination Certificate

active

11054863

ABSTRACT:
A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The high-inductance portion of the trace is proximate to a port of the integrated circuit and provides a selected inductance operating in cooperation with the capacitance of the port to reduce return loss from the port.

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