Integrated circuit package with diamond heat sink

Details Integrated circuit package with diamond heat sink Integrated circuit package with diamond heat sink

1996-04-22

1997-12-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257707, 257713, 257675, 361704, 361707, 361718, H05K 720

Patent

active

056966652

ABSTRACT:
An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.

REFERENCES:
patent: 4764804 (1988-08-01), Sahara et al.
patent: 5008737 (1991-04-01), Burnham et al.
patent: 5146314 (1992-09-01), Pankove
patent: 5379187 (1995-01-01), Lee et al.
Electrical Resistive, Thermally conductive Diamond Coating for Integrated Circuit Chips "Research Disclosure", Apr. 1988, No. 288.

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