Integrated circuit package with chip-side signal connections

Details Integrated circuit package with chip-side signal connections Integrated circuit package with chip-side signal connections

2008-01-17

2009-11-03

Louie, Wai-Sing (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C257SE21499

Reexamination Certificate

active

07611924

ABSTRACT:
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

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