Integrated circuit package with an integral heat sink and fan

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

165 803, 165122, 257722, H05K 720

Patent

active

055350941

ABSTRACT:
A module which has an integral blower that cools an integrated circuit package. The blower is attached to a heat sink that is mounted to the integrated circuit package. Heat generated by the integrated circuit conducts to the heat sink. The blower generates a stream of air that flows across the heat sink and removes heat from the package. The module may have a manifold and duct that direct the airstream across the heat sink.

REFERENCES:
patent: 4277816 (1981-07-01), Dunn
patent: 4768581 (1988-09-01), Gotwald
patent: 5218513 (1993-06-01), Brown
patent: 5253613 (1993-10-01), Bailey
patent: 5335722 (1994-08-01), Wu
patent: 5430610 (1995-07-01), Hung

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