Integrated circuit package using plastic encapsulant

Details Integrated circuit package using plastic encapsulant Integrated circuit package using plastic encapsulant

1988-04-21

1990-04-10

James, Andrew J.

357 74, 357 80, H01L 2156, H05K 506

Patent

active

049165224

ABSTRACT:
An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.

REFERENCES:
patent: 3906144 (1975-09-01), Wiley
patent: 3909838 (1975-09-01), Beyerlein
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 3959874 (1976-06-01), Coucoulas
patent: 4100675 (1978-07-01), Landsittel
patent: 4616406 (1986-10-01), Brown
patent: 4658331 (1987-04-01), Berg
patent: 4778641 (1988-10-01), Chia
patent: 4791075 (1988-12-01), Lin

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