Integrated circuit package using a multi-layer PCB in a plastic

Details Integrated circuit package using a multi-layer PCB in a plastic Integrated circuit package using a multi-layer PCB in a plastic

1994-04-04

1995-05-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257666, 257668, 257672, 257676, H05K 502

Patent

active

054207584

ABSTRACT:
An integrated-circuit package assembly including a lead frame having a number of inwardly extending fingers, the alternate ends of which are formed into an upper row and a lower row to provide a space there between for receipt of the outer edges of a multi-layer printed circuit board (PCB). Vias formed adjacent to the outer edges of the PCB engage with corresponding alternate ends of the inwardly extending fingers when the edges of the multi-layer PCB are inserted in the space provided between the row of fingers in the upper plane and the row of fingers in the lower plane. The ends of the inwardly extending fingers have various lengths which engage via contact pads formed on opposite surfaces of the PCB. A group of the fingers can be pivoted to open the space between the upper and lower row of fingers.

REFERENCES:
patent: 4766478 (1988-08-01), Dennis
patent: 4782589 (1988-11-01), Dennis
patent: 4846700 (1989-07-01), Dennis
patent: 4855866 (1989-08-01), Imamura et al.
patent: 4870224 (1989-09-01), Smith et al.
patent: 4979903 (1990-12-01), Gosselin
patent: 4989069 (1991-01-01), Hawkins
patent: 5136779 (1992-08-01), Abel et al.
patent: 5227995 (1993-07-01), Klink et al.

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