Integrated circuit package using a gas to insulate electrical co

Details Integrated circuit package using a gas to insulate electrical co Integrated circuit package using a gas to insulate electrical co

1998-04-07

2000-08-29

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 521, 361752, 257682, 257693, 257704, H01L 2328

Patent

active

061111996

ABSTRACT:
An integrated circuit package includes a number of electrical conductors that are completely or at least partially surrounded by a gas instead of a solid material (having no cavities) used in the prior art. Such use of a gas reduces the dielectric constant in a region around each of the electrical conductors, as compared to the dielectric constant of a solid dielectric material. In one implementation, a number of leads are kept separated from a substrate by a number of electrically conductive support members attached to the substrate. Each lead is electrically coupled (e.g. by a bond wire) to a die pad on a die that is supported by the package in the normal manner. The leads are initially formed as portions of a lead frame (e.g. by etching or stamping), and are held separate from each other by the respective support members. The support members are electrically coupled (e.g. by traces and vias in the substrate) to terminals (e.g. pins, balls or lands) of the package. The substrate of such a package can be formed of a non-solid material, such as a foam (e.g. of polyimide) or a mesh (e.g. of graphite strands).

REFERENCES:
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patent: 5403784 (1995-04-01), Hashemi et al.
patent: 5538433 (1996-07-01), Arisaka
patent: 5554824 (1996-09-01), Ueda et al.
patent: 5650592 (1997-07-01), Cheskis et al.
patent: 5733639 (1998-03-01), Gosselin
patent: 5890284 (1999-04-01), Chartrand et al.

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