Integrated circuit package system with stacking module

Details Integrated circuit package system with stacking module Integrated circuit package system with stacking module

2008-03-26

2010-06-22

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S123000, C438S124000, C438S127000, C257S672000, C257S690000, C257S784000, C361S813000

Reexamination Certificate

active

07741154

ABSTRACT:
An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.

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patent: 2008/0157319 (2008-07-01), Ha et al.
patent: 2008/0169549 (2008-07-01), Carson

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