Integrated circuit package system with shield and tie bar

Details Integrated circuit package system with shield and tie bar Integrated circuit package system with shield and tie bar

2008-05-21

2011-12-06

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S422000, C257S660000, C257S718000, C257S723000, C257S728000, C257S732000, C257SE23051, C174S050590, C361S800000, C361S816000, C361S818000

Reexamination Certificate

active

08072047

ABSTRACT:
An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield connected to the tie bar; and encapsulating the integrated circuit and the shield. An integrated circuit package system also includes: forming a lead and a support structure with substantially the same material as the lead and elevated above the lead; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield on the support structure; and encapsulating the integrated circuit and the shield.

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