Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-08-26
2011-10-25
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S108000, C438S123000, C438S124000, C438S127000, C257S676000, C257S777000, C257S778000, C257S686000, C257S790000
Reexamination Certificate
active
08043894
ABSTRACT:
An integrated circuit package system includes forming a first external interconnect having both a first side and a second side that is an opposing side to the first side; forming a first encapsulation around a first integrated circuit and the first external interconnect with the first side, the second side, and the first active side of the first integrated circuit exposed; forming a planar interconnect between the first active side and the second side; forming a second encapsulation covering the planar interconnect and the first active side; connecting a second integrated circuit over the first integrated circuit and the first side; and forming a top encapsulation over the second integrated circuit.
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Bathan Henry Descalzo
Camacho Zigmund Ramirez
Tay Lionel Chien Hui
Ishimaru Mikio
Nguyen Ha Tran T
Stats Chippac Ltd.
Tran Thanh Y
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