Integrated circuit package system with redistribution layer

Details Integrated circuit package system with redistribution layer Integrated circuit package system with redistribution layer

2008-09-09

2010-10-12

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S723000, C257S730000, C257S777000, C257S779000, C257S780000

Reexamination Certificate

active

07812449

ABSTRACT:
An integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.

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