Integrated circuit package system with offset stacked die

Details Integrated circuit package system with offset stacked die Integrated circuit package system with offset stacked die

2006-07-21

2010-06-01

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S676000, C257S686000, C257SE23062, C257SE23070

Reexamination Certificate

active

07727816

ABSTRACT:
An integrated circuit package system provides a leadframe having a short lead finger and a long lead finger. A first die is placed in the leadframe. A second die is offset from the first die. The offset second die is attached to the first die and the long lead finger with an adhesive. The first die is electrically connected to the short lead finger. The second die is electrically connected to at least the long lead finger or the short lead finger. At least portions of the leadframe, the first die, and the second die are encapsulated in an encapsulant.

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