Integrated circuit package system with isloated leads

Details Integrated circuit package system with isloated leads Integrated circuit package system with isloated leads

2008-03-18

2010-06-08

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C438S123000

Reexamination Certificate

active

07732901

ABSTRACT:
An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.

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