Integrated circuit package system with interference-fit feature

Details Integrated circuit package system with interference-fit feature Integrated circuit package system with interference-fit feature

2011-07-12

2011-07-12

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S680000, C257S698000, C257S787000, C257S788000, C257S789000, C257S795000, C257SE23116, C257SE23124, C257SE23168

Reexamination Certificate

active

07977778

ABSTRACT:
An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and the integrated circuit die, and encapsulating the integrated circuit die.

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