Integrated circuit package system with heat sink

Details Integrated circuit package system with heat sink Integrated circuit package system with heat sink

2007-12-18

2007-12-18

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C438S124000, C257SE21008, C257S499000, C257S502000, C257S503000

Reexamination Certificate

active

11307350

ABSTRACT:
An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of adhesive structures. The integrated circuit is encapsulated. The support bars are removed.

REFERENCES:
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5357672 (1994-10-01), Newman
patent: 5455456 (1995-10-01), Newman
patent: 5490324 (1996-02-01), Newman
patent: 6667439 (2003-12-01), Salatino et al.

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