Integrated circuit package system with external...

Details Integrated circuit package system with external... Integrated circuit package system with external...

2011-01-04

2011-01-04

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S673000, C257SE23037, C257SE21510, C257SE23043, C257SE21502, C257SE23066

Reexamination Certificate

active

07863102

ABSTRACT:
The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within the die platform; connecting the integrated circuit die and the external interconnect; and forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.

REFERENCES:
patent: 5107328 (1992-04-01), Kinsman
patent: 5200809 (1993-04-01), Kwon
patent: 5986209 (1999-11-01), Tandy
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6535388 (2003-03-01), Garcia
patent: 2002/0190377 (2002-12-01), Igarashi et al.
patent: 2003/0197262 (2003-10-01), Huang et al.
patent: 2005/0208701 (2005-09-01), Jeong et al.
patent: 2005/0224918 (2005-10-01), Kobayashi et al.
patent: 2006/0255436 (2006-11-01), Ozawa
patent: 2008/0012100 (2008-01-01), Punzalan et al.
patent: 2009/0001554 (2009-01-01), Otremba
patent: 2009/0020861 (2009-01-01), Otremba

Affiliated with

Also associated with

Rating

Integrated circuit package system with external... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system with external..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system with external... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2644169