Integrated circuit package system with dual side connection

Details Integrated circuit package system with dual side connection Integrated circuit package system with dual side connection

2011-02-08

2011-02-08

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S787000

Reexamination Certificate

active

07884457

ABSTRACT:
An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.

REFERENCES:
patent: 5780924 (1998-07-01), McCormick
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6876066 (2005-04-01), Fee et al.
patent: 2003/0178710 (2003-09-01), Kang et al.
patent: 2006/0220256 (2006-10-01), Shim et al.
patent: 2006/0244157 (2006-11-01), Carson
patent: 2007/0090495 (2007-04-01), Kim et al.
patent: 2007/0216005 (2007-09-01), Yim et al.
patent: WO2006043388 (2006-04-01), None

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