Integrated circuit package system with contoured encapsulation

Details Integrated circuit package system with contoured encapsulation Integrated circuit package system with contoured encapsulation

2011-07-26

2011-07-26

Hoang, Quoc D (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S788000, C257SE21503

Reexamination Certificate

active

07985623

ABSTRACT:
An integrated circuit package system is provided including providing a carrier, mounting an integrated circuit die on the carrier, connecting the integrated circuit die with the carrier, and forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress.

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