Integrated circuit package system with channel

Details Integrated circuit package system with channel Integrated circuit package system with channel

2011-08-30

2011-08-30

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

08009436

ABSTRACT:
An integrated circuit package system provides a substrate and contact pads are formed on the substrate. A channel is formed in the substrate between the contact pads. A circuit component is electrically connected to the contact pads, with the circuit component over the channel. The circuit component, the contact pads, and the channel are encapsulated in encapsulant, the encapsulant flowing into the channel.

REFERENCES:
patent: 5641996 (1997-06-01), Omoya et al.
patent: 6356453 (2002-03-01), Juskey et al.
patent: 6562660 (2003-05-01), Sakamoto et al.
patent: 6909178 (2005-06-01), Sakamoto et al.
patent: 6969914 (2005-11-01), Fuller et al.
patent: 7321099 (2008-01-01), Mishiro
patent: 7359211 (2008-04-01), Landeros et al.
patent: 7382628 (2008-06-01), Kawamoto et al.
patent: 2005/0017373 (2005-01-01), Nishikawa et al.
patent: 2007/0235216 (2007-10-01), Bae et al.

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