Integrated circuit package system using heat slug

Details Integrated circuit package system using heat slug Integrated circuit package system using heat slug

2006-04-10

2010-12-14

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S124000, C438S126000, C257SE23101, C257S706000, C257S707000

Reexamination Certificate

active

07851268

ABSTRACT:
An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.

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