Integrated circuit package system for stackable devices

Details Integrated circuit package system for stackable devices Integrated circuit package system for stackable devices

2008-09-25

2010-12-28

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07859094

ABSTRACT:
An integrated circuit package system provides: forming a stack module including: providing a stack die and encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die; mounting the stack module on a package base; connecting the pad to the package base; mounting a top die on the protruding support; connecting the top die to the package base; and encapsulating the top die, the package base, and the stack module with a package encapsulant.

REFERENCES:
patent: 5394010 (1995-02-01), Tazawa et al.
patent: 6075710 (2000-06-01), Lau
patent: 6369448 (2002-04-01), McCormick
patent: 6407448 (2002-06-01), Chun
patent: 6424031 (2002-07-01), Glenn
patent: 6555917 (2003-04-01), Heo
patent: 6638792 (2003-10-01), Hui et al.
patent: 6753599 (2004-06-01), Kim
patent: 6768190 (2004-07-01), Yang et al.
patent: 6815254 (2004-11-01), Mistry et al.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6861761 (2005-03-01), Yang et al.
patent: 6906416 (2005-06-01), Karnezos
patent: 7026709 (2006-04-01), Tsai et al.
patent: 7279783 (2007-10-01), Fjelstad et al.
patent: 7285850 (2007-10-01), Poo et al.
patent: 7298033 (2007-11-01), Yoo
patent: 7310458 (2007-12-01), Wehrly, Jr.
patent: 7355274 (2008-04-01), Lim
patent: 7391105 (2008-06-01), Yeom
patent: 7420814 (2008-09-01), Kim et al.
patent: 7557443 (2009-07-01), Ye et al.
patent: 7589408 (2009-09-01), Weng et al.
patent: 7608921 (2009-10-01), Pendse
patent: 2003/0067082 (2003-04-01), Moshayedi
patent: 2005/0133932 (2005-06-01), Pohl et al.
patent: 2007/0059865 (2007-03-01), Huang et al.
patent: 2007/0246815 (2007-10-01), Lu et al.
patent: 2008/0090329 (2008-04-01), Wehrly, Jr.
patent: 2008/0099890 (2008-05-01), Chen et al.
patent: 2008/0111224 (2008-05-01), Byun et al.
patent: 2009/0152740 (2009-06-01), Park et al.

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