Integrated circuit package system for stackable devices

Details Integrated circuit package system for stackable devices Integrated circuit package system for stackable devices

2011-04-05

2011-04-05

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S778000, C257SE23172, C257SE23178, C438S107000, C438S108000, C438S110000

Reexamination Certificate

active

07919871

ABSTRACT:
An integrated circuit package system includes: providing a lower interposer substrate with lower exposed conductors; attaching a die over the lower interposer substrate; applying a stack encapsulant over the die and the lower interposer substrate having the lower exposed conductors partially exposed adjacent the stack encapsulant; and attaching an upper interposer substrate having upper exposed conductors over the stack encapsulant and with the upper exposed conductors substantially exposed.

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